ASUS TUF H370 Pro Gaming Wi-Fi Socket 1151C

Características de la placa base Asus TUF H370 Pro Gaming Wifi

CPU y Chipset

• 1151 Coffee Lake socket for 8th Gen Intel® Core™ Processor
• Supports 14nm CPU
• Supports Intel® Turbo Boost Technology 2.0*
• * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.
• ** Refer to www.asus.com for Intel® CPU support list.
• Intel® H370 Chipset

Memoria

• 4 x DIMM, max. 64GB, DDR4 2666/2400/2133 MHz, non-ECC, un-buffered memory
• Dual channel memory architecture
• Supports Intel® Extreme Memory Profile (XMP)
• *DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.
• **Refer to www.asus.com for the Memory QVL (Qualified Vendors List).

Slot de expansión

• 1 x PCIe 3.0/2.0 x16 slot
• 1 x PCIe 3.0/2.0 x16 slot (max. at x4 mode)
• 4 x PCIe 3.0/2.0 x1 slots

Gráficos

• Integrated Graphics Processor- Intel® HD Graphics support
• Multi-VGA output support: HDMI/DisplayPort/D-sub ports
• - Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz / 2560 x 1600@60Hz
• - Supports DisplayPort with max. resolution 4096 x 2304 @ 60 Hz
• - Supports D-sub with max. resolution 1920*1200@60Hz
• Supports Intel® InTru™ 3D/Quick Sync Video/Clear Video HD Technology/Insider
• Maximum shared memory of 1024 MB (for iGPU exclusively)
• Supports AMD® 2-Way/Quad-GPU CrossFireX Technology

Almacenamiento

• Intel® H370 Chipset with RAID 0, 1, 5, 10 and Intel Rapid Storage Technology support
• - 1 x M.2_1 Socket 3 with M Key, type 2242/2260/2280 storage devices support (both SATA & PCIE x2 mode)*
• - 1 x M.2_2 Socket 3 with M Key, type 2242/2260/2280/22110 storage devices support (PCIE x4 mode)
• - 6 x SATA 6.0 Gb/s ports
• - Ready for Intel® Optane Memory
• *The M.2_1 socket shares SATA_2 port when use M.2 SATA mode device. Adjust BIOS settings to use a SATA device.

Conexiones

• Intel® Wireless-AC 9560 (Wi-Fi 802.11 a/b/g/n/ac)
• Bluetooth V5.0
• Intel® I219-V Gigabit LAN

Audio

• Realtek® ALC887 8-channel

USB

• Intel® H370 Chipset
• - 2 x USB 3.1 Gen 2 ports up to 10Gbps at back panel (Type-A)
• - 5 x USB 3.1 Gen 1 ports up to 5Gbps (2 ports @mid-board; 3 ports @back panel<2a1c>)
• - 6 x USB 2.0 ports (4 ports @mid-board; 2 ports @back panel)

Conexiones traseras

• 1 x D-sub port
• 1 x HDMI port
• 1 x DisPlay port
• 1 x PS/2 combo port
• 1 x LAN (RJ45) port
• 1 x Intel® Wi-Fi module
• 2 x USB 3.1 Gen 2 ports (Type-A)
• 2 x USB 3.1 Gen 1 ports
• 1 x USB 3.1 Gen 1 Type-C port
• 2 x USB 2.0 ports
• 8-channel Audio I/O ports

Conexiones internas

• 1 x USB 3.1 Gen 1 connectors support additional 2 USB ports (19-pin)
• 2 x USB 2.0 connectors support additional 4 USB ports
• 1 x M.2_1 Socket 3 (for M Key, type 2242/2260/2280 devices)
• 1 x M.2_2 Socket 3 (for M Key, type 2242/2260/2280/22110 devices)
• 6 x SATA 6.0Gb/s connectors
• 1 x CPU Fan connector (support DC/PWM mode)
• 1 x AIO_Pump header (4-pin)
• 2 x Chassis Fan connectors (4-pin) for both 3-pin(DC mode) and 4-pin(PWM mode) coolers control
• 1 x Front panel audio connector (AAFP)
• 1 x 24-pin EATX Power connector
• 1 x 8-pin EATX 12V Power connector
• 1 x System Panel
• 1 x COM port
• 1 x S/PDIF header
• 1 x RGB header
• 1 x Clear CMOS jumper

Formato

• ATX: 30.5 x 24.4 cm.