ASUS TUF B360M Plus Gaming Socket 1151
Descripción
Esta placa base Asus TUF B360M Plus Gaming sobresale en todos los niveles. Con una compatibilidad excelente y un diseño sofisticado y compacto, es una placa ideal para hacer un ordenador gaming muy competente ¡Con las placas base de ASUS seguro que acertarás! Ya en Red Computer con las mejores placa base de Asus.
Características de la placa base Asus TUF B360M Plus Gaming
CPU
- LGA1151 socket for 8th Generation Intel® Core™ i7/ i5/ i3, Pentium® and Celeron® processors
- Supports 14nm CPU
- Supports Intel® Turbo Boost Technology 2.0*
- * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.
Chipset
- Intel® B360 Chipset
Memoria
- 4 x DIMM, maximum 64 GB, DDR4 2666/ 2400/ 2133MHz, non-ECC, unbuffered memory
- Dual channel memory architecture
- Supports Intel® Extreme Memory Profile (XMP)
- * The maximum memory frequency supported varies by processor.
- ** DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.
Ranuras de expansión
- 1 x PCI Express 3.0 x16 slot (at x 16 mode)
- 2 x PCI Express 3.0 x1 slots
Gráfica
- Integrated Graphics Processor- Intel® HD Graphics support
- Multi-VGA output support: HDMI/DVI-D ports
- - Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz / 2560 x 1600@60Hz
- - Supports DVI-D with max. resolution of 1920 x 1200 @60Hz
- Maximum shared memory of 1024 MB (for iGPU exclusively)
Almacenamiento
- Intel® B360 Chipset
- - 1 x M.2_1 Socket 3 with M key, type 2242/2260/2280 storage devices support (both SATA & PCIE 3.0 x 4 mode)*
- - 1 x M.2_2 Socket 3 with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode)**
- - 6 x SATA 6.0 Gb/s ports (gray)
- - Intel® Optane™ Memory Ready**
- * When a device in SATA mode is installed on the M.2_1 socket, SATA_2 port cannot be used.
- ** Only the M.2_2 socket can support Intel® Optane™ memory.
LAN
- Intel® 1219-V Gigabit LAN
- -Dual interconnect between the integrated Media Access Controller (MAC) and physical layer (PHY)
- TUF LANGuard
Audio
- Realtek® ALC887 8-channel* high definition audio CODEC
- - Audio Shielding: Ensures precision analog/digital separation and greatly reduces multi-lateral interference
- - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
- - Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity.
- - Supports jack-detection and front panel jack-retasking
USB
- Intel® B360 Chipset
- - 2 x USB 3.1 Gen 2 (up to 10Gbps) ports (2 ports @back panel, teal blue, Type A)
- - 3 x USB 3.1 Gen 1 (up to 5Gbps) ports (2 ports @mid-board, 1 port @back panel, Type C)
- - 6 x USB 2.0/1.1 ports (4 ports @mid-board, 2 ports @back panel, black, Type A)
Conectores internos E/S
- 1 x USB 3.1 Gen 1 (up to 5Gbps) connector support additional 2 USB ports (19-pin)
- 2 x USB 2.0/1.1 connectors support additional 4 USB ports
- 6 x SATA 6.0Gb/s connectors (gray)
- 2 x M.2 Socket 3 (for M Key, type 2242/2260/2280 devices)
- 1 x CPU Fan connector
- 2 x Chassis Fan connectors (4-pin) for both 3-pin(DC mode) and 4-pin(PWM mode) coolers control
- 1 x Front panel audio connector (AAFP)
- 1 x System panel connector
- 1 x S/PDIF out header
- 1 x COM Header
- 1 x 24-pin EATX Power connector
- 1 x 8-pin EATX 12V Power connector
- 1 x Clear CMOS jumper
- 1 x Aura RGB Strip header
E/S panel trasero
- 1 x PS/2 keyboard/mouse combo port
- 1 x HDMI port
- 1 x DVI-D port
- 1 x LAN (RJ45) ports
- 2 x USB 3.1 Gen 2 (up to 10Gbps) Type A (teal blue)
- 1 x USB 3.1 Gen 1 (up to 5Gbps) Port C
- 2 x USB 2.0/1.1 ports
- 3 Audio jacks support 8 channel*
- * Use a chassis with HD audio module in the front panel to support an 8-channel audio output.
Factor de forma
- mATX Form Factor, 9.6”x 9.1” (24.4cm x 23.1cm)
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